Sign In | Join Free | My himfr.com
Home > Ceramics Substrate >

3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates

Wuxi Special Ceramic Electrical Co.,Ltd
Trust Seal
Verified Supplier
Credit Check
Supplier Assessment
Contact Now
    Buy cheap 3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates from wholesalers
     
    Buy cheap 3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates from wholesalers
    • Buy cheap 3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates from wholesalers
    • Buy cheap 3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates from wholesalers
    • Buy cheap 3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates from wholesalers
    • Buy cheap 3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates from wholesalers

    3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates

    Ask Lasest Price
    Brand Name : wuxi special ceramic
    Price : us$1~us$100/P
    Payment Terms : T/T
    Supply Ability : 1000000p/Month
    Delivery Time : 30days
    • Product Details
    • Company Profile

    3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates

    laser cutting alumina ceramic precision made industrial substrate

    The ceramic substrate, is a sheet-like material that forms a supporting base for the film circuit component and the externally-applied component on the basis of the electronic ceramic. According to the application field of ceramic substrate, it is divided into HIC (hybrid integrated circuit) ceramic substrate, focusing potentiometer ceramic substrate, laser heating fixing ceramic substrate, chip resistor substrate, network resistor Substrate, etc.; according to different processing methods, ceramic substrates are divided into two types: molded tablets and laser scribe films.


    3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates

    Type of ceramic cutting: alumina zirconia silicon nitride aluminum nitride ceramics;
    Cutting the highest precision: ± 0.02;
    Cutting maximum size: 1*152.4*152.4mm;
    Cutting minimum aperture: diameter φ0.1mm;
    Cutting maximum thickness: 1.5mm (mm);
    Number of cuts: The more the better.

    NameCeramic Substrate
    ColorWhite(general)
    SpecificationsCustomized
    Accuracy±0.01
    Density3.8g/cm3
    HardnessRockwell hardness HRA89 (steel knife hardness HRC60) Mohs hardness is 9; HV1500-1700
    Modulus of elasticity380GPa
    Bending strength300Mpa
    Compressive strength2500MPa
    Melting point2050 ° C
    High temperature resistance1800 ° C
    Thermal conductivity39W/(m.K)
    Thermal expansion coefficient8.6X10-6/°C
    Breakdown strength (insulation strength)15KV/mm
    Resistivity1015/Ω.m

    company information


    Wuxi Special Ceramic Co.,Ltd mainly produces alumina, Silicon nitride, Zirconia, Steatite, Boron nitride, Cordierite,mullite products, widely used in metal welding, electronic conductor, mechanics, assembling, insulation, chemicals, instrument, textile, nuclear industry, aerial field.We accept trial produce according to the drawing or sample.It usually takes 30 days to finish trial product.Mass produce usually takes 30 days.Goods' package is carton or PLT.It can be negotiable with each other.
    We mainly sell goods to toshiba lighting group in Japan and Europe.Our aim is to deliver goods with high quality at quick delivery date.



    Quality 3.8g cm3 1.5mm Precision Industrial Slice Si3O4 Laser Machining Ceramics Substrates for sale
    Inquiry Cart 0
    Send your message to this supplier
     
    *From:
    *To: Wuxi Special Ceramic Electrical Co.,Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)